4layer Pi Immersion Gold FPC/Circuit Board/Flexible PCB
| US$0.10 - 10.00 | 1 Piece (MOQ) |
Port:
Yantian, China
Production Capacity:
500000/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Dongguan Everpcb Technology Co., Ltd.
Guangdong, China
Last Login Date:
May 29, 2025
Main Products:
PCB Board, Circuit Board, PCBA, Rigid-Flexible PCB Board, HDI PCB Board, Aluminium PCB Board, Printed Circuit Board, Flexible Printed Circuit Board
Product Description
Company Info
Basic Info.
Model NO.
427164
Structure
Double-Sided FPC
Material
Polyimide
Combination Mode
Adhesive Flexible Plate
Application
Automotive
Conductive Adhesive
Conductive Silver Paste
Flame Retardant Properties
V0
Processing Technology
Delay Pressure Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Copper Thickness
1/2 Oz
Finished Surface
Immersion Gold
Stifferer
Steel Stiffer
Trademark
EVERPCB
Transport Package
Vacuumize
Origin
China
HS Code
8534009000
Product Description
Material:FR-4
thickness:1mil
copper:ED 1/2 oz
cover layer:1/2mil
PI stiffener :5mil
finished surface:immersion gold
thickness:1mil
copper:ED 1/2 oz
cover layer:1/2mil
PI stiffener :5mil
finished surface:immersion gold
Product capability
| Layers | Maximum Layer Count | 1~32 | tolerance |
| Size | Maximum shipping Panel Size | 600mmx550mm | +/-0.15mm |
| Board Thickness | Minimum Board Thickness | 0.4mm (4L)0.6mm (6L) | +/-0.1mm |
| Maximum Board Thickness | 3.6mm | +/-10% | |
| Copper Thickness | 0.5~5 oz | ||
| Via Holes | Minimum Via | 0.2mm | PTH +/-0.075mm |
| Buried Vias | Yes | NPTH +/-0.05mm | |
| Blind Vias | Yes | ||
| Ratio | Maximum Aspect Ratio | 10:01 | |
| Trace | Minimum Line Width (Internal) | 0.075mm | The tolerance followed by IPC-6012 |
| Minimum Line Spacing (Internal) | 0.075mm | ||
| Minimum Line Width (External) | 0.075mm | ||
| Minimum Line Spacing (External) | 0.075mm | ||
| Surface Finish | Selective Soft Gold (MCM) | 0.025~0.1 um | |
| Selective Hard Gold (SIMM) | 0.025~1.0 um | ||
| Immersion Gold (Ni/Au) | 0.025~0.1 um | ||
| HASL | min. 2.5 um | ||
| Lead Free HASL | min. 2.5 um | ||
| OSP (Entek CU106A) | 0.2~0.5 um | ||
| Immersion Tin | min. 0.625 um | ||
| Immersion Silver | min. 0.175 um | ||
| Carbon Ink | Yes | ||
| Other Finish | Peelable mask | ||
| Material | Composite | CEM-1 | |
| CEM-3 | |||
| Glass Fiber | FR-4 | ||
| High Tg FR-4 | |||
| Other Materials | Aluminum, Polyimide | ||
| Solder Mask | LPI | Yes | |
| UV | Yes | ||
| Thermal | Yes | ||
| Reliability | Controlled Impedance/tolerance | Yes | +/- 10% |
| Ionic Contaminant | Yes | max. 1.56 ug/cm2 | |
| Microsection | Yes | ||
| Solderability Test | Yes | ||
| Hi Pot Test | Yes | 500~1000V | |
| Certificate | ISO 9000 | Yes | |
| ISO 14000 | Yes | ||
| TS 16949 | Yes | ||
| UL | Yes | ||
EVERPCB provides 1~32layers(include 1~8oz copper thickness PCB and HDI) PCB and PCB assembly services to a wide range of companies in the Consume , Computer, Industrial, RF products, Automotive, Securities, medical, Telecommunications and other electronics equipment markets. As a full service turnkey supplier of custom electronics, EVERPCB can provide support from design and prototyping to new product introduction and full rate production. The main idea of running this business is to locate any potential customers around the world and extensively supplying them with good quality PCBs and related assembly services.
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